a deeptech and purpose-driven company
Advanced Materials, Better for the Planet
Impact of temperature on power electronics
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Reduce device lifetime
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Limit the device performance
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Increase the power consumption
Current methods for thermal management are no longer effective to address new generation of power electronic devices
CVD Diamond growth on semiconductor substrates
Patented technology
Diamond
on GaN on Si
Next generation
Semiconductor Wafer
High quality Diamond on semiconductor substrates with enhanced physical properties than traditional electronic wafers at an affordable price
Benefits for electronic devices
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Performance Enhanced
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Size Reduced
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Temperature Minimized
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Power Consumption Dropped
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Lifespan Prolonged
Steady-state Temperature
with Heat Spreaders
Next generation
Technologies
Diamond heat spreaders are very efficient:
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50°C of temperature reduction !
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Electronic lifetime multiply by 5 !
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Thermal Dissipation multiply by 8 (vs Si & GaN) !
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Similar thermal performances as expensive GaN on Diamond
“ICT’s share of global greenhouse gas emissions actually lies between 2.1-3.9 %. ICT GHG emissions could be as high as 8 % by 2025»
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Advantages of diamond
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Diamond has the highest bulk thermal conductivity
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Passive cooling approach as heat spreaders
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Good p-type semiconductor properties
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Excellent potential for power electronics
